By separating the power board from the controller board, heat sources are effectively isolated from temperature-sensitive components, ensuring heightened reliability. The multi-layer heat dissipation structure design, comprising an aluminum terminal, aluminum substrate, and low internal resistance MOS, facilitates a 40% faster heat dissipation rate. This innovative approach not only enhances the durability of the system but also improves overall performance, setting a new standard for efficiency and heat management in electric bike components.